HRDP® Manufacturing Facility Expansion, Dedicated Carrier for Next Generation Semiconductor Packaging

Mitsui Mining and Smelting Co., Ltd (President and Representative Director: Takeshi Nou; hereinafter “Mitsui Kinzoku”) and GEOMATEC Co., Ltd (CEO: Kentaro Matsuzaki; hereinafter “GEOMATEC”) have teamed up to build a mass production system for the commercialization of HRDP®,1 specialty carrier for next-generation semiconductor packaging. Mitsui Kinzoku is pleased to announce that we have decided to invest in a second production line at the Ako GEOMATEC plant to increase production capacity and expand DOE facilities.

300mm wafer type HRDP® product (In special case for product delivery) Image Credit: Business Wire

​​​​​​​Developed by Mitsui Kinzoku, HRDP® are special carriers that achieve the very high density designs with L/S of 2/2 μm or less required for the next generation of semiconductor packaging.

Currently, several major semiconductor companies have started full-scale development of next-generation semiconductor packages using HRDP®. In response to this, Mitsui Kinzoku decided to further improve quality and increase production capacity by introducing a second HRDP® line at the Ako GEOMATEC plant, scheduled to start operating in 2025. At the same time, GEOMATEC will invest in the thin film process used in this second line.

In addition, by expanding DOE facilities2 already operational, we will accelerate co-development with major semiconductor companies using HRDP®. This will allow customers to shorten cycle times.3

With the installation of a second line and expansion of the DOE facility, we will be able to respond rapidly to increased development demands and move towards HRDP adoption® and the expansion of their use in mass production in the future next-generation semiconductor market. This capital investment will be carried out in stages from 2023 to 2025.

Based on our goal, “We promote world prosperity through the spirit of exploration and diverse technologies.” We will contribute to the semiconductor packaging market by expanding our HRDP® business and contribute to the creation of a sustainable society through our business activities.

Explanation of Terms

  1. High Resolution Debondable Panels.
  2. DOE: Experimental Design. Development facility to identify and solve problems first by verifying customer designs.
  3. The number of processes and time required to manufacture a semiconductor package. If this can be reduced, optimal semiconductor device manufacturing efficiency can be achieved.
  4. Redistribution Layer


SDMDP DevelopmentTM Material for Ultra Fine Circuit Forming with Glass Carrier for Fan Out Panel Level Package (released January 25, 2018)

HRDP Mass Production Initiation®Custom Cup Carrier for Next Generation Semiconductor Packaging Devices (released January 25, 2021)

HRDP Mass Production® Dedicated Carrier for Next Generation Semiconductor Packaging Devices commenced for Overseas market (released December 14, 2021)

Video illustrating the final processing of the chip using HRDP®


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