Archer Achieves Material Qubit Functions at Room Temperature in Air

Archer Materials Limited (“Archer”, “Company”), a semiconductor company advancing the quantum computing and medical diagnostics industries, has achieved a significant development milestone in its advanced qubit material functionality.

Figure 1. Archer staff at the semiconductor prototyping and research foundry in Sydney, Australia, operates several of the instruments used to encapsulate the qubit material. Image Credits: Limited Archer Materials

​​​​​​The company recently optimized the room temperature functionality of its qubit material (ASX ann. 8 Jun, 2023). Until recently, there was a need for a vacuum or an inert atmosphere when operating qubit materials to maintain a decent quantum coherence time. To advance the Company 12With the development of the CQ chip, there was a requirement for a simple and practical solution to overcome the air-induced quantum decoherence in qubit materials.

The Archer team now for the first time preserved the time and quantum coherence properties of a qubit material at room temperature in air while retaining the intrinsic metal-like character of the qubit material. Importantly, quantum coherence time satisfies the lower bound requirement for performing gate operations for quantum information processing. In the context of developing qubit processors, implementing foundry-compatible processes to easily handle and process qubit materials while maintaining quantum coherence is important.

The Archer team was able to achieve this important development by applying atomic layer deposition (“ALD”) methods, as well as plasma-enhanced chemical vapor deposition (“PECVD”), to encapsulate qubit materials with atomic layer control at nanometer and micrometer thicknesses. metal oxide films and other semiconductors.

Commenting on the newly developed nanomaterial technology, Dr Mohammad Choucair, CEO of Archer, said,

“This is a major accomplishment for qubit Archer development. This demonstrates the strength of Archer’s strategy to be a driver for the sector, with our innovations making qubit materials potentially more accessible and easier to embed in modern semiconductor fabrication processes for the manufacture of quantum logic devices.”

“Archer has now demonstrated that the quantum coherence time of his observed material qubits at room temperature is achievable under normal conditions, in air. This means the approach has the potential of technology translation for Archer’s industrial scale 12CQ qubit chip architecture.

“It is remarkable that Archer’s carbon qubit material is so production-ready yet remains robust post-processing to produce such a fragile quantum state for the long enough time period required for quantum logic operations in the qubit devices we are currently developing.

“Archer is steadily moving ever closer to making real-world quantum processing devices that are much easier to manufacture in everyday electronics with this latest achievement.”


Quantum coherence is a fundamental requirement for the quantum logic operations that form the basis of every hardware quantum computing qubit processor. For the potential integration and use of qubit materials in practical chip devices, it is important to demonstrate and validate toughness at room temperature and in atmospheric environments.

Earlier this year, Archer announced it was working towards a potential breakthrough in semiconductor foundry packaging 12CQ chip architecture (ASX ann. 16 March 2023). As part of that work, nanodevice engineers Archer have developed a method for encapsulating the matter of its qubits. The encapsulation approach involves coating a qubit material with a nanometer-thin passivation layer, mimicking an ‘artificial vacuum’. The main purpose of encapsulation is to allow the qubit material to function under ambient conditions3. This work uses the common semiconductor foundry cleanroom processing method.

This milestone relates to Archer’s future operations and fabrication processing 12The CQ chip and builds on previous work focused on qubit materials and device fabrication optimization (ASX ann. 14 Oct, 2021 and 8 Jun, 2023).


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